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Giesecke+Devrient unveils iSIM solution for IoT devices

Tue, 3rd Dec 2024

Giesecke+Devrient Mobile Security has announced a new Integrated SIM (iSIM) solution for the Internet of Things (IoT), in collaboration with Telit Cinterion.

The new iSIM operating system is designed for Narrowband IoT (NB-IoT) applications and is built on a chipset from Sony Semiconductor Israel. This iSIM is intended to enhance the connectivity, security, and sustainability of next-generation IoT devices.

By partnering with Telit Cinterion, G+D has developed a solution that supports various NB-IoT use cases, including smart metering, smart agriculture, and asset tracking. One of the main components is the iSIM or integrated universal integrated circuit card (iUICC), which acts as a tamper-resistant element within a system-on-a-chip (SoC).

The iSIM is a hardware component isolated from its baseband chipset, forming a single connectivity module. This configuration offers several benefits, such as improved power consumption, reduced cost, enhanced sustainability, and increased security. The iSIM's compact size allows for the creation of smaller, lighter, and more cost-effective devices while also fulfilling high sustainability standards.

G+D's secure iSIM-OS, which is certified and capable of running on multiple chipsets, has been successfully qualified with a leading global network operator on the Telit Cinterion NE310L2 NB-IoT module, utilising the Sony Altair ALT1255 chipset. This marks a significant milestone for G+D as one of the early providers of an operating system tailored for Sony's low-power, cost-efficient Altair chipset for NB-IoT purposes.

The iSIM-OS is platform-independent, ensuring optimal function across various iSIM-enabled chipsets, including the Sony Altair ALT1250, ALT1255, and ALT1350 LTE-M and NB-IoT chipsets. This flexibility highlights G+D's dedication to offering solutions applicable to a wide array of IoT applications and devices.

BeeGek Lim, Global Vice President and Head of Business Line Digital Offerings at G+D, stated, "G+D is investing heavily in the research and development of iSIM technology. In close cooperation with industry partners, we want to drive iSIM innovation forward. The successful development and qualification of an optimised iSIM-OS for a cost-effective and commercially available NB-IoT product is a perfect example of this in action."

Lim also emphasised, "In general, one of our main priorities is to provide secure solutions for a wide range of IoT applications and devices, so that users can realise the full potential of the IoT with flexible and cost-optimised connectivity."

Jose Sanchez, Senior Director of Product Management, IoT Connectivity & Services at Telit Cinterion, commented, "Telit Cinterion is happy to be part of the co-operation between G+D and Sony Semiconductor Israel on this first innovative technology achievement. We look forward to working with our partners to stay at the forefront of iSIM technology for IoT in the coming years."

Dima Feldman, VP of Product Management and Marketing at Sony Semiconductor Israel, noted, "We are excited to collaborate with Telit Cinterion and G+D to enable iSIM on our LPWA products. ALT1255 is the first NB-IoT chipset on the market with iSIM. iSIM enables connectivity without additional physical hardware, which simplifies the solution and logistical onboarding flow, and making it more affordable which is a key for the industrial IoT market."

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